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On January 8, 2003, IBM and AMD announced they would collaborate on 65 nanometer (nm) and 45nm chip technologies to be implemented on 300 millimeter silicon wafers. New processes will aim at improving microprocessor performance and reducing power consumption and will use advanced structures and materials such as high-speed silicon-on-insulator (SOI) transistors, copper interconnects, and improved "low-k dielectric" insulation.
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Though, 65nm technologies will not be in place till 2006 (estimated). This will definetly give AMD the upper hand when the industry reaches this technology node. AMD has yet to navigate the next 3 years first. But with IBM's manufacturing expertise, any problems with yield will be rectified quickly and efficiently.
Posted 02:07, 21 January 2003 by ReDuX
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mm pie
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IBM & AMD, Next-Gen Chip Collaboration.
Serial ATA at last !
